Filter Products Showing all 11 results
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Filter Products Showing all 11 results
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    EGP 1,450 EGP 1,325

    – Total Capacity: 16GB (1x16GB)

    – Memory Profile: 3200MHz, 15-15-15, 1.2V

    – Part Number: HX424C15FB3/16

    – Warranty: One Year

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    EGP 750 EGP 675

    – Total Capacity: 8GB (1x8GB)

    – Memory Profile: 3200MHz, 15-15-15, 1.2V

    – Part Number: HX424C15FB3/8

    – Warranty: One Year

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    EGP 1,650 EGP 1,500

    – Total Capacity: 16GB (1x16GB)

    – Memory Profile: 3200MHz, 15-15-15, 1.2V

    – Part Number: HX424C15FB3/16

    – Warranty: One Year

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    EGP 875 EGP 800

    – Total Capacity: 8GB (1x8GB)

    – Memory Profile: 3200MHz, 15-15-15, 1.2V

    – Part Number: HX424C15FB3/8

    – Warranty: One Year

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    EGP 1,000 EGP 900
    – 16GB TED416G2666C1901
    – 2666mhz
    – Warranty : One Year
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    EGP 350 EGP 310
    • Memory Size: 4 GB
    • Memory Technology: DDR4 SDRAM
    • Memory Voltage: 1.20 V
    • Memory Speed: 2666 MHz
    • Memory Standard: DDR4-2666/PC4-21300
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    EGP 1,000 EGP 925
    -Speeds up to 2666 MT/s and faster data rates are expected to be available as DDR4 technology matures

     

    -Increase bandwidth by up to 30 percent. ECC:NON-ECC

     

    -Reduce Power consumption by up to 40 percent and extend battery life

     

    -Faster burst access speeds for improved sequential data throughput

     

    -Optimized for next Generation Processors and Platforms
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    EGP 550 EGP 500

    -Speeds up to 2666 MT/s and faster data rates are expected to be available as DDR4 technology matures
    -Increase bandwidth by up to 30 percent. ECC:NON-ECC
    -Reduce Power consumption by up to 40 percent and extend battery life
    -Faster burst access speeds for improved sequential data throughput
    -Optimized for next Generation Processors and Platforms

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    EGP 800 EGP 675

    -Armor design for perfect protection; Aluminum alloy heat sink with high performance; High thermal conductive adhesive
    -Supports Intel & AMD motherboards; Selected high-quality IC; Supports XMP2.0; Energy saving with ultra-low working voltage
    -3200MHz 8GB CL16-18-18-38; 25,600 MB/s (PC4 25600) 1.35V 288 Pin Unbuffered DIMM Non ECC
    -Dimensions: 43.5(H) x 141(L) x 8.3(W)mm
    -Lifetime warranty

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    EGP 850 EGP 750

    -Armor design for perfect protection; Aluminum alloy heat sink with high performance; High thermal conductive adhesive
    -Supports Intel & AMD motherboards; Selected high-quality IC; Supports XMP2.0; Energy saving with ultra-low working voltage
    -3600MHz 8GB CL18-22-22-42; 28,800 MB/s (PC4 28800) 1.35V 288 Pin Unbuffered DIMM Non ECC
    -Dimensions: 43.5(H) x 141(L) x 8.3(W)mm
    -Lifetime warranty

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    EGP 1,800 EGP 1,575

    -Full frame 120° ultra wide angle lighting with built-in Force Flow RGB lighting effect
    -Aluminum alloy heat spreader with asymmetric minimalist design
    -Supports T-FORCE BLITZ control (Beta version) / ASUS Aura Sync software synchronization
    -Supports XMP2.0 one-click overclocking technology; QVL approved by all mainstream motherboard manufacturers
    -Lifetime warranty

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